US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Seamless bonding layers in semiconductor packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,639, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Seamless bonding layers in semiconductor packages and methods of forming the same" was invented by Chih-Chia Hu (Taipei, Taiwan) and Ming-Fa Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Seamless bonding layers in semiconductor packages and methods of forming the same are disclosed. In an embodiment, a method includes forming a second passivation layer over a first metal pad and a second metal pad, the first metal pad and the second metal pad being disposed over a first passivation layer of a first semiconductor die; deposit...