US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 13 for "Seal ring structure and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,636, issued on May 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD (Hsinchu, Taiwan).

"Seal ring structure and method of fabricating the same" was invented by Yen Lian Lai (New Taipei, Taiwan) and Chun Yu Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor structure that includes dielectric layers disposed over a semiconductor substrate; and a seal ring structure formed in the dielectric layers and distributed in multiple metal layers. The seal ring structure further includes first metal lines of a metal layer disposed in a first area and longitudinally oriented alon...