US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Package structure and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,598, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of fabricating the same" was invented by Yi-Wen Wu (New Taipei, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan) and Ming-Che Ho (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a package structure including a die; an electrically connecting structure having a die attach region and a peripheral region surrounding the die attach region, wherein the die is disposed on the electrically connecting structure within the die attach region; an insulating protrusion disposed in the peripheral region and extendin...