US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Mixed poly pitch design solution for power trim" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,299,372, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Mixed poly pitch design solution for power trim" was invented by Shih-Wei Peng (Hsinchu, Taiwan), Lipen Yuan (Hsinchu County, Taiwan), Jiann-Tyng Tzeng (Hsinchu, Taiwan) and Wei-Cheng Lin (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit with mixed poly pitch cells with a plurality of different pitch sizes is disclosed. The integrated circuit includes: at least a minimum unit each with at least a first number of first poly pitch cells with a first pitch size, and a second number of second poly pitch cells with a...