ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,506, issued on May 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Method of manufacturing semiconductor devices" was invented by Yi-Chen Lo (Zhubei, Taiwan), Yi-Shan Chen (Tainan, Taiwan), Chih-Kai Yang (Taipei, Taiwan) and Pinyen Lin (Rochester, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of forming a pattern over a semiconductor substrate, a target layer to be patterned is formed over a substrate, a mask pattern including an opening is formed in a mask layer, a shifting film is formed in an inner sidewall of the opening, a one-directional etching operation is performed to remove a part o...