ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,601, issued on May 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD (Hsinchu, Taiwan).
"Interconnect structure" was invented by Lin-Yu Huang (Hsinchu, Taiwan), Li-Zhen Yu (New Taipei, Taiwan), Chia-Hao Chang (Hsinchu, Taiwan), Cheng-Chi Chuang (New Taipei, Taiwan), Kuan-Lun Cheng (Hsin-Chu, Taiwan) and Chih-Hao Wang (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and the manufacturing method thereof are disclosed. An exemplary method includes receiving a workpiece including a dielectric layer and a contact via extending through the dielectric layer, selectively forming a metal featur...