US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,571, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Shu-Rong Chun (Hsinchu, Taiwan), Kuo-Lung Pan (Hsinchu, Taiwan), Pei-Hsuan Lee (Tainan, Taiwan), Chien Ling Hwang (Hsinchu, Taiwan), Yu-Chia Lai (Zhunan Township, Taiwan), Tin-Hao Kuo (Hsinchu, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: a package component including integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsu...