US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 13 for "Integrated circuit and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,642, issued on May 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit and method of forming the same" was invented by Kuang-Ching Chang (Hsinchu, Taiwan), Jung-Chan Yang (Hsinchu, Taiwan), Hui-Zhong Zhuang (Hsinchu, Taiwan), Chih-Liang Chen (Hsinchu, Taiwan) and Kuo-Nan Yang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes a first power rail on a back-side of a wafer and being configured to supply a first voltage, a header circuit coupled to the first power rail and being configured to supply the first voltage to the first power rail, a second and t...