US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Integrated chip with solid-state power storage device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,628, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated chip with solid-state power storage device" was invented by Yi Ching Ong (Hsinchu, Taiwan), Kuen-Yi Chen (Hsinchu, Taiwan), Yi-Hsuan Chen (Taoyuan, Taiwan), Kuo-Ching Huang (Hsinchu, Taiwan) and Harry-Hak-Lay Chuang (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an integrated chip including a first metal layer over a substrate. A second metal layer is over the first metal layer. An ionic crystal layer is between the first metal layer and the second metal layer. A metal oxide layer is betw...