US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Integrated chip with good thermal dissipation performance" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,566, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated chip with good thermal dissipation performance" was invented by Harry-Hak-Lay Chuang (Zhubei, Taiwan), Hsin Fu Lin (Hsinchu County, Taiwan), Shiang-Hung Huang (New Taipei, Taiwan) and Tsung-Hao Yeh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards an integrated chip (IC). The IC comprises a substrate. A semiconductor device is disposed on the substrate. An interlayer dielectric (ILD) structure is disposed over the substrate and the semiconductor device. A fi...