ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,670, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Hybrid bond pad structure" was invented by Sin-Yao Huang (Tainan, Taiwan), Chun-Chieh Chuang (Tainan, Taiwan), Ching-Chun Wang (Tainan, Taiwan), Sheng-Chau Chen (Tainan, Taiwan), Dun-Nian Yaung (Taipei, Taiwan), Feng-Chi Hung (Chu-Bei, Taiwan) and Yung-Lung Lin (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes a first integrated chip (IC) tier and a second IC tier. The second IC tier comprises a second plurality...