US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Fan-out package with controllable standoff" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,592, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Fan-out package with controllable standoff" was invented by Po-Hao Tsai (Taoyuan, Taiwan), Techi Wong (Zhubei, Taiwan), Meng-Wei Chou (Zhubei, Taiwan), Meng-Liang Lin (Hsinchu, Taiwan), Po-Yao Chuang (Hsinchu, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming an interposer, which includes forming a rigid dielectric layer, and removing portions of the rigid dielectric layer. The method further includes bonding a package component to an interconnect structure, and bonding the interpose...