US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Edge-trimming methods for wafer bonding and dicing" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,664, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Edge-trimming methods for wafer bonding and dicing" was invented by Feng-Chien Hsieh (Pingtung, Taiwan), Yun-Wei Cheng (Taipei, Taiwan), Mu-Han Cheng (Tainan, Taiwan), Kuo-Cheng Lee (Tainan, Taiwan) and Hsin-Chi Chen (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A front-side peripheral region of a first wafer may be edge-trimmed by performing a first pre-bonding edge-trimming process. A second wafer to be bonded with the first wafer is provided. Optionally, a front-side peripheral region of the second wafer may be edge-trimmed by p...