ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,644, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Die bonding pads and methods of forming the same" was invented by Wen-Hsiung Lu (Tainan, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan), Chia-Li Lin (Tainan, Taiwan), Yu-Chih Huang (Hsinchu, Taiwan) and Chen-Shien Chen (Zhubei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: a dielectric layer over an active surface of a semiconductor substrate; a conductive via in the dielectric layer, the conductive via including a first copper layer having a non-uniform grain orientation; and a bonding pad over the conductive...