ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,496, issued on May 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).
"Deposition window enlargement" was invented by Meng-Han Chou (Hsinchu, Taiwan), Kuan-Yu Yeh (Taoyuan, Taiwan), Wei-Yip Loh (Hsinchu, Taiwan), Hung-Hsu Chen (Tainan, Taiwan), Su-Hao Liu (Chiayi County, Taiwan), Liang-Yin Chen (Hsinchu, Taiwan), Huicheng Chang (Tainan, Taiwan) and Yee-Chia Yeo (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method to enlarge the process window for forming a source/drain contact. The method may include receiving a workpiece that includes a source/drain feature exposed ...