US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Chiplets 3 D SoIC system integration and fabrication methods" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,646, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Chiplets 3 D SoIC system integration and fabrication methods" was invented by Chen-Hua Yu (Hsinchu, Taiwan) and Kuo-Chung Yee (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming integrated circuits on a front side of a first chip, performing a backside grinding on the first chip to reveal a plurality of through-vias in the first chip, and forming a first bridge structure on a backside of the first chip using a damascene process. The bridge structure has a first bond pad, a second bond pad, and a conductive trac...