ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,632, issued on May 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Chip package with lid" was invented by Shu-Shen Yeh (Taoyuan, Taiwan), Chin-Hua Wang (New Taipei, Taiwan), Kuang-Chun Lee (New Taipei, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan), Shyue-Ter Leu (Hsinchu, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package includes a substrate, a semiconductor chip, and a thermal conductive structure. The chip package includes a first and a second support structures below the thermal conductive structure. The first and the second support structures ...