US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 13 for "Chemical mechanical polishing method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,508, issued on May 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Chemical mechanical polishing method" was invented by Tung-Kai Chen (New Taipei, Taiwan), Ching-Hsiang Tsai (Hsinchu, Taiwan), Kao-Feng Liao (Hsinchu, Taiwan), Chih-Chieh Chang (Hsinchu County, Taiwan), Chun-Hao Kung (Hsinchu, Taiwan), Fang-I Chih (Tainan, Taiwan), Hsin-Ying Ho (Kaohsiung, Taiwan), Chia-Jung Hsu (Changhua County, Taiwan), Hui-Chi Huang (Hsinchu County, Taiwan) and Kei-Wei Chen (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A planarization method includes: providing a substrate, wherein the substrate includes a f...