ALEXANDRIA, Va., June 12 -- United States Patent no. 12,296,428, issued on May 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).
"Chemical mechanical polishing apparatus and method" was invented by Yen-Liang Chen (Taichung, Taiwan), Jun-Xiu Liu (Taichung, Taiwan) and Chia-Hsien Chou (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A polish head of a chemical mechanical polishing system is provided. The polish head includes a carrier head, a membrane mounted to the carrier head, an inner retaining ring mounted to the carrier head and surrounding the membrane, an outer retaining ring mounted to the carrier head and surrounding the inner retaining ring, and an im...