US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Bond pad structure for bonding improvement" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,663, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bond pad structure for bonding improvement" was invented by Chin-Wei Liang (Zhubei, Taiwan), Sheng-Chau Chen (Tainan, Taiwan), Hsun-Chung Kuang (Hsinchu, Taiwan) and Sheng-Chan Li (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor device includes receiving a device substrate; forming an interconnect structure on a front side of the device substrate; and etching a recess into a backside of the device substrate until a portion of the interconnect structure is exposed. The recess has a recess depth a...