US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Aligning bumps in fan-out packaging process" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,659, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Aligning bumps in fan-out packaging process" was invented by Ying-Jui Huang (Zhubei, Taiwan), Chien Ling Hwang (Hsinchu, Taiwan), Chih-Wei Lin (Zhubei, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes placing a first package component and a second package component over a carrier. The first conductive pillars of the first package component and second conductive pillars of the second package component face the carrier. The met...