US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Adhesive and thermal interface material on a plurality of dies covered by a lid" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,574, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Japan).

"Adhesive and thermal interface material on a plurality of dies covered by a lid" was invented by Chih-Hao Chen (Taipei, Taiwan), Chin-Fu Kao (Taipei, Taiwan), Li-Hui Cheng (New Taipei, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan) and Chih-Chien Pan (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a package structure and a method of forming the same. The package structure includes a first die, a second die group, an interposer, an underfill layer, a thermal interface material (TIM), and an adhesive pattern. The first die and the s...