US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 4 for "Semiconductor structure and method for forming the same" (Taiwanese, American Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,741, issued on March 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method for forming the same" was invented by Johnny Chiahao Li (Hsinchu, Taiwan), Shih-Ming Chang (Hsinchu County, Taiwan), Ken-Hsien Hsieh (Taipei, Taiwan), Chi-Yu Lu (New Taipei, Taiwan), Yung-Chen Chien (Kaohsiung, Taiwan), Hui-Zhong Zhuang (Kaohsiung, Taiwan), Jerry Chang Jui Kao (Taipei, Taiwan) and Xiangdong Chen (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a conductive member over a first conductive line; forming a second conductive line over the conductive member; and r...