US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 4 for "Semiconductor device structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,872, issued on March 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device structure and methods of forming the same" was invented by Chen-Huang Huang (Hsinchu, Taiwan), Yu-Ling Cheng (Tainan, Taiwan), Shun-Hui Yang (Taoyuan, Taiwan), An Chyi Wei (Hsinchu, Taiwan), Chia-Jen Chen (Hsinchu, Taiwan), Shang-Shuo Huang (Kaohsiung, Taiwan), Chia-I Lin (Taipei, Taiwan) and Chih-Chang Hung (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure, along with methods of forming such, are described. The structure includes a first channel region disposed over a substra...