US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 4 for "Semiconductor device structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,780, issued on March 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device structure and method for forming the same" was invented by Ching-Wei Tsai (Hsinchu, Taiwan), Yu-Xuan Huang (Hsinchu, Taiwan), Kuan-Lun Cheng (Hsin-chu, Taiwan), Chih-Hao Wang (Baoshan Township Hsinchu County, Taiwan), Min Cao (Hsinchu, Taiwan), Jung-Hung Chang (Changhua County, Taiwan), Lo-Heng Chang (Hsinchu, Taiwan), Pei-Hsun Wang (Kaohsiung, Taiwan) and Kuo-Cheng Chiang (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor device structure is provided. The method includes fo...