US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 4 for "Package structure with lid and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,800, issued on March 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure with lid and method for forming the same" was invented by Shin-Puu Jeng (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Hsinchu County, Taiwan), Feng-Cheng Hsu (New Taipei, Taiwan), Shuo-Mao Chen (New Taipei, Taiwan) and Chin-Hua Wang (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a package structure is provided. The method includes disposing a semiconductor die over a carrier substrate, wherein a removable film is formed over the semiconductor die, disposing a first stacked die packa...