US Patent Issued to Taiwan Semiconductor Manufacturing on March 4 for "Package structure, semiconductor device comprising grating coupler and reflector structure embedded in the dielectric layer" (Taiwanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,860, issued on March 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure, semiconductor device comprising grating coupler and reflector structure embedded in the dielectric layer" was invented by Feng-Wei Kuo (Hsinchu County, Taiwan) and Chewn-Pu Jou (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a photonic die, an electronic die and a gap filling layer. The photonic die includes a dielectric layer, a silicon layer, a reflector structure and a plurality of connection pads. The silicon layer is disposed on the dielectric layer, wherein the silicon layer inc...