US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 4 for "Method of testing semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,788, issued on March 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of testing semiconductor package" was invented by Chi-Hui Lai (Taichung, Taiwan), Yang-Che Chen (Hsin-Chu, Taiwan), Chen-Hua Lin (Yunlin County, Taiwan), Victor Chiang Liang (Hsinchu, Taiwan) and Chwen-Ming Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of testing a semiconductor package includes: forming a charge measurement unit over a carrier substrate; forming a first dielectric layer over the charge measurement unit; forming a first metallization layer over the dielectric layer, wherein the forming of ...