US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 4 for "Method of forming testing module and method for using the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,787, issued on March 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of forming testing module and method for using the same" was invented by Jen-Yuan Chang (Hsinchu, Taiwan), Kong-Beng Thei (Hsinchu County, Taiwan) and Jung-Hui Kao (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming an integrated circuit and a testing pattern over a die region of a wafer and a scribe line region of the wafer, respectively, in which the integrated circuit and the testing pattern are formed by a same fabrication process; connecting a via of a testing chip to a testing pad of the testi...