US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 4 for "Integrated circuit having three-dimensional transistors and seal ring structure with monitoring pattern" (Taiwanese Inventor)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,873, issued on March 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit having three-dimensional transistors and seal ring structure with monitoring pattern" was invented by Kuo-Yang Chia (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) manufacturing method includes: forming, in a device region of the semiconductor wafer, fins of fin field-effect transistors (finFETs) of the IC; forming, in a seal ring region surrounding the device region, at least one seal ring comprising fins encircling the device region and a monitoring pattern comprising fins encircl...