US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 4 for "Conductive line structures and method of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,821, issued on March 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Conductive line structures and method of forming same" was invented by Hiranmay Biswas (Hsinchu, Taiwan), Chi-Yeh Yu (Hsinchu, Taiwan), Kuo-Nan Yang (Hsinchu, Taiwan), Chung-Hsing Wang (Hsinchu, Taiwan), Stefan Rusu (Hsinchu, Taiwan) and Chin-Shen Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A conductive line structure includes: first and second offset sets of long pillars that are substantially coaxial on an intra-set basis; a third set of offset short pillars, the short pillars being: overlapping of long pillars in the...