US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Vertical interconnect structures in three-dimensional integrated circuits" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,152, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Vertical interconnect structures in three-dimensional integrated circuits" was invented by Tzu-Hsien Yang (Hsinchu, Taiwan), Hiroki Noguchi (Hsinchu, Taiwan), Hidehiro Fujiwara (Hsinchu, Taiwan) and Yih Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D IC structure includes multiple die layers, such as a top die layer and a bottom die layer. The top die layer and/or the bottom die layer each includes devices such as computing units, Analog-to-Digital converters, analog circuits, RF circuits, logic circuits, sensors, Input...