US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 25 for "Thermoelectric cooling of semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,199, issued on March 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Thermoelectric cooling of semiconductor devices" was invented by Jen-Yuan Chang (Hsinchu, Taiwan), Jheng-Hong Jiang (Hsinchu, Taiwan), Chin-Chou Liu (Hsinchu County, Taiwan) and Long Song Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device includes a chip having a semiconductor substrate and a thermoelectric module embedded in the semiconductor substrate, where the thermoelectric module includes a first semiconductor structure electrically connected to a second semiconductor structure, where ...