US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 25 for "Structure and method of power supply routing in semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,167, issued on March 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Structure and method of power supply routing in semiconductor device" was invented by Shih-Wei Peng (Hsinchu, Taiwan) and Jiann-Tyng Tzeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first cell. The first cell includes: a first source/drain region and a second source/drain region in a first layer; a plurality of gate electrodes in a second layer, the plurality of gate electrodes defining at least one odd-numbered track and at least one even-numbered track; a first power rail extending in ...