US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Semiconductor structure including thermal enhanced bonding structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,142, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure including thermal enhanced bonding structure" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Chun-Hui Yu (Hsinchu County, Taiwan), Jeng-Nan Hung (Taichung, Taiwan), Kuo-Chung Yee (Taoyuan, Taiwan) and Po-Fan Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A structure including a first semiconductor die and a second semiconductor die is provided. The first semiconductor die includes a first bonding structure. The first bonding structure includes a first dielectric layer and first conductors embedded in ...