US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 25 for "Semiconductor structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,218, issued on March 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method of forming the same" was invented by Yi-Huan Chen (Hsinchu, Taiwan), Chien-Chih Chou (New Taipei, Taiwan), Szu-Hsien Liu (Hsinchu County, Taiwan) and Kong-Beng Thei (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes: a substrate; a doped region within the substrate; a pair of source/drain regions extending along a first direction on opposite sides of the doped r...