US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Semiconductor package having an encapulant comprising conductive fillers and method of manufacture" (Taiwanese, American Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,095, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package having an encapulant comprising conductive fillers and method of manufacture" was invented by Xinyu Bao (Fremont, Calif.), Lee-Chung Lu (Taipei, Taiwan), Jyh Chwen Frank Lee (Palo Alto, Calif.), Fong-Yuan Chang (Hsinchu, Taiwan), Sam Vaziri (San Jose, Calif.) and Po-Hsiang Huang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Packaged semiconductor devices including high-thermal conductivity molding compounds and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a fi...