US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Semiconductor package and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,102, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method of forming the same" was invented by Li-Ling Liao (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Che-Chia Yang (Taipei, Taiwan), Po-Chen Lai (Hsinchu County, Taiwan), Po-Yao Lin (Hsinchu County, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution structure, a first conductive pillar and a second conductive pillar, and a semiconductor device. The redistribution structure has a first surface and a second surface opposite to...