US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Semiconductor package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,092, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and manufacturing method thereof" was invented by Tzu-Sung Huang (Tainan, Taiwan), Ming-Hung Tseng (Miaoli County, Taiwan), Yen-Liang Lin (Taichung, Taiwan), Ban-Li Wu (Hsinchu, Taiwan), Hsiu-Jen Lin (Hsinchu County, Taiwan), Teng-Yuan Lo (Hsinchu, Taiwan) and Hao-Yi Tsai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor device, an encapsulating material, a redistribution structure, and an adhesive residue. The encapsulating material encapsulates a first part of...