ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,126, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor package" was invented by Tsung-Hsien Chiang (Hsinchu, Taiwan), Hsien-Ming Tu (Hsinchu County, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan) and Tin-Hao Kuo (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes an encapsulated semiconductor device, a backside redistribution structure, and a front side redistribution structure. The encapsulated semiconductor device includes an encapsulating material and a semiconductor device encapsulated by the encapsulating material. The backside redistribution s...