US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Semiconductor devices and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,115, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacturing thereof" was invented by Kam-Tou Sio (Zhubei, Taiwan) and Jiann-Tyng Tzeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first active region, disposed on a first side of a substrate, that extends along a first lateral direction. The semiconductor device includes a second active region, disposed on the first side, that extends along the first lateral direction. The first active region has a first conduction type and the second active region has ...