US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 25 for "Semiconductor device and method for manufacturing the same" (American, Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,259,605, issued on March 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and method for manufacturing the same" was invented by Wen-Shun Lo (Hsinchu County, Taiwan) and Yingkit Felix Tsui (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a semiconductor substrate, a first dielectric layer, a second dielectric layer, a light modulator, a heater, and a first conductive contact. The first dielectric layer is disposed on the semiconductor substrate. The second dielectric l...