US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Photonic semiconductor device and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,259,578, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Photonic semiconductor device and method of manufacture" was invented by Hsing-Kuo Hsia (Jhubei, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan), Kuo-Chiang Ting (Hsinchu, Taiwan) and Shang-Yun Hou (Jubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a first photonic package, wherein forming the first photonic package includes patterning a silicon layer to form a first waveguide, wherein the silicon layer is on an oxide layer, and wherein the oxide layer is on a substrate; forming vias extending into the substrate; form...