US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 25 for "Particle removing assembly and method of servicing assembly" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,612, issued on March 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Particle removing assembly and method of servicing assembly" was invented by Meng-Hsueh Wu (Hsinchu, Taiwan), Fang Yu Kuo (Hsinchu, Taiwan), Kai Yu Liu (Hsinchu, Taiwan), Yu-Chun Wu (Hsinchu, Taiwan), Jau-Sheng Huang (Hsinchu, Taiwan) and Wei-Yi Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embod...