ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,088, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structure and method of forming the same" was invented by Jen-Jui Yu (Taipei, Taiwan), Hao-Jan Pei (Hsinchu, Taiwan), Cheng-Ting Chen (Taichung, Taiwan), Chih-Chiang Tsao (Taoyuan, Taiwan), Hsiu-Jen Lin (Hsinchu County, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a die, an encapsulation layer, a redistribution layer structure and an adhesive material. The die includes a semiconductor substrate, conductive pads disposed over the semiconductor substrate and a pass...