US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Multiple semiconductor die container load port" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,069, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Multiple semiconductor die container load port" was invented by Chih-Hung Huang (Hsinchu, Taiwan), Cheng-Lung Wu (Zhunan Township, Taiwan), Yi-Fam Shiu (Toufen, Taiwan), Yu-Chen Chen (Hemei Township, Taiwan), Yang-Ann Chu (Hsinchu, Taiwan) and Jiun-Rong Pai (Jhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the hous...