US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Molded dies in semiconductor packages and methods of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,163, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Molded dies in semiconductor packages and methods of forming same" was invented by Jie Chen (New Taipei, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan) and Ming-Fa Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes an interposer having a first redistribution structure; a first die directly bonded to a first surface of the first redistribution structure with a dielectric-to-dielectric bond and a metal-to-metal bond; a second die directly bonded to the first surface of the first redistribution structure with a diel...