US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Method for forming chip package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,125, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method for forming chip package structure" was invented by Heh-Chang Huang (Hsinchu, Taiwan), Fu-Jen Li (Hsinchu, Taiwan), Pei-Haw Tsao (Tai-chung, Taiwan) and Shyue-Ter Leu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure is provided. The chip package structure includes a first chip structure including a substrate and an interconnect layer over the substrate. The chip package structure includes a second chip structure over the interconnect layer. The chip package structure includes a first conductive bump...