US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Interposer with warpage-relief trenches" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,133, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interposer with warpage-relief trenches" was invented by Tsung-Yang Hsieh (Taipei, Taiwan), Chien-Chang Lee (Miaoli County, Taiwan), Chia-Ping Lai (Hsinchu, Taiwan), Wen-Chung Lu (Hsinchu, Taiwan), Cheng-Kang Huang (Hsinchu, Taiwan), Mei-Shih Kuo (Hsinchu, Taiwan) and Chih-Ai Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method is provided for forming an integrated circuit (IC) chip package structure. The method includes: providing an interposer having a front surface and a back surface, the interposer comprising a subs...