US Patent Issued to Taiwan Semiconductor Manufacturing on March 25 for "Integrated circuit packages" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,151, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit packages" was invented by Chia-Hao Hsu (Hsinchu, Taiwan), Yung-Chi Lin (New Taipei, Taiwan) and Wen-Chih Chiou (Miaoli County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are integrated circuit packages and methods of forming the same. An integrated circuit package includes at least one first die, a plurality of bumps, a second die and a dielectric layer. The bumps are electrically connected to the at least one first die at a first side of the at least one first die. The second die is electrically connected ...